Fujitsu Microelectronics Asia Pte Ltd (FMAL) has launched two new Consumer FCRAM memory chips with operating temperature range that has been extended to a high-temperature of 125°C for the first time in memory with a DDR SDRAM interface.
Sample shipment of the two new FCRAM products, the 512Mbit (MB81EDS516545), and 256Mbit (MB81EDS256545), will start from today. These products are low power consumption memory optimised for use in system-in-packages (SiPs) in digital consumer products such as digital TVs and digital video camcorders.
Customers can use these new FCRAM chips combined with a System-on-Chip (SoC) in a SiP configuration, in that as the temperature of the SiP rises with the increase of operating speed, the operation is not damaged or limited by the memory.
In addition, there are the benefits of reduced development effort needed for product design, reduced board space, as well as a reduction in the number of components.
The digital consumer products of today continue to demand higher performance and faster speeds as well as low costs. The use of SiPs also decreases the number of necessary components as well as reducing board space, thus helping to lower system costs. SiPs also make design easier, such as for the development of high-speed memory interfaces or for noise reduction measures.
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